Compact Thin-Film Packaged RF-MEMS Switched Capacitors

被引:0
|
作者
Nadaud, Kevin [1 ]
Roubeau, Fabien [1 ]
Pothier, Arnaud [1 ]
Blondy, Pierre [1 ]
Zhang, Lin-Yang [2 ]
Stefanini, Romain [2 ]
机构
[1] Univ Limoges, UMR CNRS 7252, XLIM, 123 Ave Albert Thomas, F-87060 Limoges, France
[2] AirMems, 1 Ave ESTER, F-87069 Limoges, France
关键词
Microelectromechanical systems; Package; RF-MEMS; Switches;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the design, the realization and the measurement of a thin-film packaged RF-MEMS switched capacitors. Packaging is included in microelectronics fabrication process, with Silicon Nitride thin film. The capacitors are actuated by deflecting thin gold metal membranes towards the package dielectric, increasing the capacitance by a factor 2.3. The device size, including its packaging, is 50 x 40 mu m(2). Pull-in and release voltages have less than 5V variation between 20 degrees C and 85 degrees C. The device has been tested with 20 dBm applied power and shows no sensitivity to incident power.
引用
收藏
页数:4
相关论文
共 50 条
  • [41] BISMUTH-BASED GLASSES FOR THIN-FILM CAPACITORS DEPOSITED BY RF SPUTTERING
    TITCHMARSH, JG
    TOOMBS, PAB
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1970, 7 (01): : 103 - +
  • [42] DC-Switchable and Tunable Piezoelectricity in RF Thin-Film BST Capacitors
    Capanu, Mircea
    Bernacki, Thomas
    Zelner, Marina
    Woo, Paul
    Cervin-Lawry, A.
    Divita, Charles
    2008 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, 2008, : 333 - 336
  • [43] Thin-film piezoelectric MEMS
    Eom, Chang-Beom
    Trolier-McKinstry, Susan
    MRS BULLETIN, 2012, 37 (11) : 1007 - 1021
  • [44] Thin-film piezoelectric MEMS
    Chang Beom Eom
    Susan Trolier-McKinstry
    MRS Bulletin, 2012, 37 : 1007 - 1017
  • [45] MEMS with thin-film aerogel
    Fan, SK
    Kim, CJ
    Paik, JA
    Dunn, B
    Patterson, PR
    Wu, MC
    14TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST, 2001, : 122 - 125
  • [46] Ultra thin packaging of the RF-MEMS devices with low loss
    Park, YK
    Kim, YK
    Kim, H
    Lee, DJ
    Park, HW
    Kim, CJ
    Ju, BK
    NANOTECH 2003, VOL 2, 2003, : 384 - 387
  • [47] Glass cap packaged high isolating Ka-Band RF-MEMS switch
    Stehle, A.
    Georgien, G.
    Ziegler, V.
    Schoenlinner, B.
    Prechtel, U.
    Seidel, H.
    Schmid, U.
    Galvanotechnik, 2009, 100 (05): : 1208 - 1210
  • [48] SMALL, LOW-OHMIC RF MEMS SWITCHES WITH THIN-FILM PACKAGE
    Wunnicke, O.
    Kwinten, H.
    van Leuken-Peters, L.
    In't Zandt, M.
    Reimann, K.
    Aravindh, V.
    Suy, H. M. R.
    Goossens, M. J.
    Wolters, R. A. M.
    Besling, W. F. A.
    van Beek, J. T. M.
    Steeneken, P. G.
    2011 IEEE 24TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2011, : 793 - 796
  • [49] DC-Contact RF MEMS Switches using Thin-Film Cantilevers
    Shen, Hui
    Gong, Songbin
    Barker, N. Scott
    2008 EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE (EUMIC), 2008, : 382 - 385
  • [50] Design, Fabrication and Measurements of Reliable Low Voltage RF-MEMS Switched Varactors
    Gauvin, J.
    Barriere, F.
    Mardivirin, D.
    Pothier, A.
    Crunteanu, A.
    Blondy, P.
    Vendier, O.
    Cazaux, J. L.
    2011 6TH EUROPEAN MICROWAVE INTEGRATED CIRCUIT CONFERENCE, 2011, : 434 - 437