Electron beam inspection system based on the projection imaging electron microscope

被引：34

作者：

Miyoshi, M ^{[1
]}

Yamazaki, Y ^{[1
]}

Nagahama, I ^{[1
]}

Onishi, A ^{[1
]}

Okumura, K ^{[1
]}

机构：

[1] Toshiba Co Ltd, Proc & Mfg Engn Ctr, Semicond Co, Isogo Ku, Yokohama, Kanagawa 2358522, Japan

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2001年 / 19卷 / 06期

关键词：

D O I：

10.1116/1.1421561

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An electron beam inspection system based on the projection imaging electron microscope was developed and the proof-of-concept system has been constructed and evaluated. The secondary electrons are projected through the projection imaging optics and imaged onto the image detection system. The projected secondary electron image is amplified by the microchannel plate and converted to an optical image by the fluorescent screen and detected by the 2048 element, eight-tap time delay and integration (TDI) image sensor. The stage is linearly moved in synchronism with the TDI signal output data rate, and then, the secondary electron image is continuously captured. The spatial resolution of around 0.1 mum has been obtained in this experiment. Several images obtained by the TDI imaging mode are also demonstrated. (C) 2001 American Vacuum Society.

引用

页码：2852 / 2855

页数：4

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