Micromachined Terahertz Rectangular Waveguide Bandpass Filter on Silicon-Substrate

被引：49

作者：

Hu, Jiang ^{[1
]}

Xie, Shanyi ^{[1
]}

Zhang, Yong ^{[1
]}

机构：

[1] Univ Elect Sci & Technol China, Sch Elect Engn EE, Chengdu 611731, Sichuan, Peoples R China

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2012年 / 22卷 / 12期

关键词：

Bandpass filter (BPF); micro-electro-mechanical systems (MEMS); rectangular waveguide; terahertz (THz);

D O I：

10.1109/LMWC.2012.2228179

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A micromachined 385 GHz rectangular waveguide cavity bandpass filter is presented. The proposed filter is fabricated using deep reactive ion etching on silicon substrate, with sputtered gold inner surface metallization. The vector network analyzer measured results show the lowest insertion loss is about 2.7 dB with a 15 GHz bandwidth. Effects of micro-electro-mechanical systems process on the filter's performance are discussed in detail.

引用

页码：636 / 638

页数：3

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