A vision and robot based on-line inspection monitoring system for electronic manufacturing

被引:28
作者
Edinbarough, I
Balderas, R
Bose, S
机构
[1] Univ Texas, Dept Engn, Brownville, TX 78520 USA
[2] Univ Texas, Dept Mfg Engn, Edinburg, TX 78539 USA
关键词
machine vision; robotic inspection; neural network; solder defects; electronic manufacturing;
D O I
10.1016/j.compind.2005.05.022
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
This paper presents a neural network-based vision inspection system interfaced with a robot to detect and report IC lead defects on-line. The vision system consists of custom software that contains a neural network database for each of the ICs to be inspected on a PCB. The vision system uses gray scale images and a single layer neural network with three outputs based on defect criteria. Each IC has a different inspection area, thus, the input vector varies for each of the ICs. The IC networks were trained with Matlab's Bayesian regularization module. Performance of each of the networks investigated was found to be 100%, based on the defect criteria. This system has been implemented and tested on several electronic products using ProE, C++ and OpenGL software platforms [R. Balderas, S. Bose, Automated robotic inspection system for electronic manufacturing, MSE Thesis, Manufacturing Engineering Department, UT-Pan American, 2002; A.I. Edinbarough. J. Amieva, Experimental study on the robotics vision inspection of electronic components, BS Thesis, Engineering Technology Department, UT-Brownsville, 2002]. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:986 / 996
页数:11
相关论文
共 8 条
  • [1] AUTOMATED VISUAL INSPECTION - 1981 TO 1987
    CHIN, RT
    [J]. COMPUTER VISION GRAPHICS AND IMAGE PROCESSING, 1988, 41 (03): : 346 - 381
  • [2] AUTOMATED VISUAL INSPECTION - A SURVEY
    CHIN, RT
    HARLOW, CA
    [J]. IEEE TRANSACTIONS ON PATTERN ANALYSIS AND MACHINE INTELLIGENCE, 1982, 4 (06) : 557 - 573
  • [3] HATA S, 1990, IECON 90, VOLS 1 AND 2, P792, DOI 10.1109/IECON.1990.149241
  • [4] KASHITANI A, 1993, IEEE T MECHATRONICS, P1865
  • [5] LANDERS TL, 1994, ELECT MANUFACTURING, V3
  • [6] OKABE T, 1993, IEEE T, V3, P1877
  • [7] Sankaran V., 1998, IEEE Transactions on Components, Packaging & Manufacturing Technology, Part C (Manufacturing), V21, P148, DOI 10.1109/3476.681394
  • [8] SANKARAN V, 1995, IEE CPMT INT MAN TEC, P232