Ultrawide Bandwidth Chip-to-Chip Interconnects for III-V MMICs

被引：7

作者：

Fay, Patrick ^{[1
]}

Kopp, David ^{[1
]}

Lu, Tian ^{[2
]}

Neal, David ^{[2
]}

Bernstein, Gary H. ^{[1
]}

Kulick, Jason M. ^{[2
]}

机构：

[1] Univ Notre Dame, Dept Elect Engn, Notre Dame, IN 46556 USA

[2] Indiana Integrated Circuits LLC, South Bend, IN 46617 USA

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2014年 / 24卷 / 01期

关键词：

Interconnects; millimeter-wave; MMIC packaging; quilt packaging;

D O I：

10.1109/LMWC.2013.2288181

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Ultrawide bandwidth coplanar waveguide interconnects between GaAs chips based on a novel fabrication process are demonstrated. Fabricated structures on 100 thick GaAs chips exhibited chip-to-chip insertion losses below 1 dB up to 110 GHz, and below 2.2 dB up to 220 GHz from on-wafer S-parameter measurements. A return loss larger than 10 dB from 100MHz to 220 GHz was measured. The measured responses are consistent with numerical simulations, including the effects of excess solder at the chip-to-chip interface. Numerical simulations indicate that further improvements in performance, with insertion losses as low as 1.1 dB at 220 GHz, should be possible by minimizing the excess solder.

引用

页码：29 / 31

页数：3

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