A Statistical Assessment of Opto-Electronic Links

被引：4
|
作者：
Manfredi, Paolo [1 ]
Stievano, Igor S. [1 ]
Perrone, Guido [1 ]
Bardella, Paolo [1 ]
Canavero, Flavio G. [1 ]
机构：
[1] Politecn Torino, Dept Elect & Telecommun, I-10129 Turin, Italy
来源：
2012 IEEE 21ST CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS | 2012年
关键词：
Circuit modeling; circuit simulation; optical interconnects; stochastic analysis; stochastic collocation; tolerance analysis; uncertainty; INTERCONNECT; SIMULATION;
D O I：
10.1109/EPEPS.2012.6457843
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper addresses the stochastic simulation of high-speed optical interconnects. It provides an effective solution for the inclusion of the effects of process variation or possible unknown device characteristics on the system response. The proposed approach is based on the stochastic collocation method and Lagrange interpolation. The results obtained on the transient analysis of a realistic on-board optical link with uncertain parameters conclude the paper.
引用
收藏
页码：61 / 64
页数：4
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