Microstructural development of Cu-Sn-Ti alloys on graphite

被引：34

作者：

Hsieh, Yu-Chan ^{[1
]}

Lin, Shun-Tian ^{[1
]}

机构：

[1] Natl Taiwan Univ Sci & Technol, Dept Mech Engn, Taipei 106, Taiwan

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2008年 / 466卷 / 1-2期

关键词：

Intermetallics; Metals and alloys; Microstructure; Crystal structure;

D O I：

10.1016/j.jallcom.2007.11.038

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Cu-Sn-Ti ternary alloys are ideal brazing alloys for diamond. A simulated study was carried out to evaluate the wetting behavior of this group of alloys on graphite, and examine the phase development at temperatures ranging from 850 degrees C to 1000 degrees C. The results indicated that the addition of Ti enhanced the wetting behavior, but its optimal concentration was affected by the concentration of Sn in the alloy. Increasing the concentration of Ti at 10 at.% Sn promoted the formation of CuSn3Ti5 and SnTi3 intermetallic compounds. while increasing the concentration of Sn at 10 at.% Ti promoted the formation of Sn3Ti5 and Sn3Ti2 intermetallic compounds. (C) 2007 Elsevier B.V. All rights reserved.

引用

页码：126 / 132

页数：7

共 13 条

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