Solvent Bonding of a Drug Delivery Device by Using Hansen Solubility Parameters

被引：3

作者：

Herrlich, S. ^{[1
]}

Lorenz, T. ^{[1
]}

Spieth, S. ^{[1
]}

Messner, S. ^{[1
]}

Zengerle, R. ^{[1
]}

机构：

[1] Hahn Schickard Gesell eV HSG IMIT, Inst Mikro & Informat Tech, D-78052 Villingen Schwenningen, Germany

来源：

PROCEEDINGS OF THE 8TH INTERNATIONAL CONFERENCE ON MULTI-MATERIAL MICRO MANUFACTURE (4M 2011) | 2011年

关键词：

Solvent Bonding; Hansen Solubility Parameters; Drug Delivery Device;

D O I：

10.3850/978-981-07-0319-6_208

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A parameter based approach for selecting hybrid thermoplastic material combinations for solvent bonding by applying the supposed Hansen Solubility Parameter (HSP) model is demonstrated. This new method allows identification of (i) appropriate material combinations as well as (ii) less harmful or more cost effective solvents to replace potentially toxic combinations. The required number of experimental trials is minimized with respect to conventional selection techniques in both cases. Exemplary, the HSP model was successfully applied to select the polymer material of a flexible membrane as well as a suitable solvent mixture for bonding with a rigid cyclic olefin copolymer (COC). The rigid/flexible material bond is the integral part of a miniaturized microfluidic drug delivery device based on osmotic pumping. Characterizations of the bond quality in the assembled device confirmed the predictions of the model as a promising engineering tool.

引用

页码：38 / 41

页数：4

共 9 条

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