Power Integrity Simulation for Multilayer Power Distribution Networks Based on GTLE and Via Model

In high-speed applications, electronic packages usually contain multilayer power-ground planes with large number of P-G vias to provide a low-impedance path for the power distribution system between the PCB and the die. The transient current injected into the P-G planes can induce unintentional voltage fluctuations in the power distribution network of the packages. The undesired voltage fluctuations can be significant even for the packages with solid P-G planes due to the return currents of switching input/output lines. A major problem arising in power distribution networks is simultaneous switching noise (SSN) which is induced by the power and ground inductance. This paper presents a numerical approach that combines the 20 generalized transmission line equations (GTLE) method and multi-layer finite-difference frequency-domain (FDFD) method to model and analyze the two-dimensional electromagnetic problem arising in multilayered power distribution planes. The results of our analysis method are compared to those from a full-wave simulator to show efficiency in power integrity simulation.