Development of Processing Map for 7075 Al/20% SiCp Composite

The hot deformation behavior and microstructure evolution of 7075 Al/20% SiCp composite have been studied using the processing map. Compression tests were carried out in the temperature range of 300-500 degrees C and at the strain rate range of 0.001-1.0 s(-1). The stable and unstable regions in the map were verified with the microstructural observations of the deformed compression specimens. The "stable" regions, i.e., dynamic recrystallization and "unstable" regions such as debonding of SiC particles, matrix crack, and adiabatic shear band formation were identified from the processing map and compared with the reported microstructural observations of the deformed compression specimens. The optimum hot working conditions for this composite were identified.