A fully packaged 4x4 integrated optical switch matrix

被引：4
作者：
Varrazza, R [1 ]
Bricheno, T
Yu, SY
机构：
[1] Univ Bristol, Dept Elect & Elect Engn, Bristol BS8 1UB, Avon, England
[2] Afon, Witney OX28 4GW, England
来源：
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 2005年 / 11卷 / 06期
关键词：
integrated optoelectronics; micro-optics; optical cross-connect; optical crosspoint switch (OXS); optical multicast switching; optical packet switching (OPS); optoelectronic device packaging;
D O I：
10.1109/JSTQE.2005.860994
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper describes a packaged and fiber array coupled 4 x 4 optical crosspoint switch designed for optical packet switching. Alignment and fixation techniques of two perpendicular fiber arrays to the integrated InP-based switch chip have been developed. Thermal management is also included in the packaging. The packaged devices demonstrate long-term stability and have been used in switch modules, including the packaged device and electronic interfaces.
引用
收藏
页码：1248 / 1254
页数：7
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