An X-band System-in-Package active antenna module

被引：8

作者：

Khandelwal, N ^{[1
]}

Jackson, RW ^{[1
]}

机构：

[1] Univ Massachusetts, Dept Elect & Comp Engn, Amherst, MA 01003 USA

来源：

2005 IEEE MTT-S International Microwave Symposium, Vols 1-4 | 2005年

关键词：

active antenna; BGA (Ball Grid Array); multilayer packaging; System-in-Package(SiP); transceiver;

D O I：

10.1109/MWSYM.2005.1516840

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

System-in-Package (SiP) is based on the concept of combining all the electronic requirements of a system into a single package. Along with providing cost and size benefits, SiP with an integrated antenna can help mitigate the feed network losses and phase errors in an antenna array based application. This paper presents the development of a low cost, compact RF front end SiP solution for X-band. A printed antenna is integrated with a multilayer BGA package using low cost laminate substrates. This active antenna module can be further integrated into arrays and used for wireless as well as sensing applications.

引用

页码：1019 / 1022

页数：4

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