In-Situ Observation of Ultrasonic Bonding Using High Speed Camera

被引：0

作者：

Shuto, T. ^{[1
,2
]}

Asano, T. ^{[1
]}

机构：

[1] Kyushu Univ, Grad Sch Informat Sci & Elect Engn, Fukuoka 8190395, Japan

[2] Japan Soc Promot Sci, Tokyo, Japan

来源：

2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2014年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. "Softening" of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.

引用

页码：45 / 45

页数：1

共 4 条

[1]

Iwanabe K., 2014, P EL COMP T IN PRESS

[2] EFFECTS OF ULTRASOUND ON DEFORMATION CHARACTERISTICS OF METALS [J].

LANGENECKER, B .

IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1966, SU13 (01) :1-+

[3] Room-temperature bonding of heterogeneous materials for near-infrared image sensor [J].

Shuto, Takanori ;

Iwanabe, Keiichiro ;

Ogura, Mutsuo ;

Nishida, Katsuhiko ;

Asano, Tanemasa .

JAPANESE JOURNAL OF APPLIED PHYSICS, 2014, 53 (04)

[4] Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface [J].

Wang, Fuliang ;

Chen, Yun ;

Han, Lei .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (06) :852-858

← 1 →