Simulation and Design of a Hot-film Air Flow Sensor with Sapphire as Substrate

被引：0

作者：

Xu, Chunlin ^{[1
]}

Zhan, Shannan ^{[1
]}

Chu, Jingcao ^{[1
]}

Wang, Xuefang ^{[1
]}

Liu, Sheng ^{[2
]}

机构：

[1] Huazhong Univ Sci & Technol, Inst Microsyst, Sch Mech & Engn, Wuhan, Peoples R China

[2] Wuhan Univ, Cross Disciplinary Inst Engn Sci, Sch Power & Mech Engn, Wuhan, Peoples R China

来源：

2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年

关键词：

sapphire; air flow sensor; temperature difference;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A finite element model for evaluating the performance of the MEMS air flow sensor with sapphire as substrate was established. The temperature distribution of the MEMS sensor chip with respect to different air flow was calculated by COMSOL Multiphysics. The trenches etched in the substrate were used to reduce the heat transfer from the heater to the temperature measuring thermistors within the substrate. The influences of the width and depth of the trenches on the output of the sensor chip were analyzed. The simulation results shows the potential of using sapphire substrate for processing the MEMS air flow sensor.

引用

页码：257 / 260

页数：4

共 6 条

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