Study on the thermal interaction mechanism between C4F7N-N2 and copper, aluminum

被引：31

作者：

Li, Yi ^{[1
]}

Zhang, Xiaoxing ^{[1
,2
]}

Chen, Qi ^{[1
]}

Zhang, Ji ^{[1
]}

Chen, Dachang ^{[1
]}

Cui, Zhaolun ^{[1
]}

Xiao, Song ^{[1
]}

Tang, Ju ^{[1
]}

机构：

[1] Wuhan Univ, Sch Elect Engn & Automat, Wuhan 430072, Hubei, Peoples R China

[2] Chongqing Univ, State Key Lab Power Transmiss Equipment & Syst Se, Chongqing 400044, Peoples R China

来源：

CORROSION SCIENCE | 2019年 / 153卷

关键词：

C4F7N-N-2; Copper; Aluminum; Interaction; SF6 alternative gas; GAS-MIXTURE; SF6; INSULATION; REPLACE; SURFACE; FLUORONITRILES/CO2; ADSORPTION; XPS;

D O I：

10.1016/j.corsci.2019.03.031

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The thermal interaction mechanism between C4F7N (fluorinated nitrile)-N-2 gas mixture using as substitute to SF6 with metal was investigated. We found that interaction between C4F7N-N-2 and copper leads to surface corrosion or gas decomposition with interface temperature at 120 degrees C-220 degrees C. The oxidation of copper and accumulation of F, CFx and CN can be found and gaseous by-products such as C3F6, CF3H, C3F6O is produced. C4F7N-N-2 has better compatibility with aluminum than that of copper due to the existence of alumina. The interaction between C4F7N and alumina surface has the lowest adsorption energy, charge transfer compared with that of copper and aluminum.

引用

页码：32 / 46

页数：15

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