On the Thermal Load of the Color-Conversion Elements in Phosphor-Based White Light-Emitting Diodes

被引：37

作者：

Fulmek, Paul ^{[1
]}

Sommer, Christian ^{[2
]}

Hartmann, Paul ^{[2
]}

Pachler, Peter ^{[3
]}

Hoschopf, Hans ^{[3
]}

Langer, Gregor ^{[4
]}

Nicolics, Johann ^{[1
]}

Wenzl, Franz P. ^{[2
]}

机构：

[1] Vienna Univ Technol, Inst Sensor & Actuator Syst, A-1040 Vienna, Austria

[2] JOANNEUM RES Forsch Gesm bH, Inst Surface Technol & Photon, A-8160 Weiz, Austria

[3] Tridonic Jennersdorf GmbH, A-8380 Jennersdorf, Austria

[4] Austria Technol & Syst Tech AG, A-8700 Leoben, Austria

来源：

ADVANCED OPTICAL MATERIALS | 2013年 / 1卷 / 10期

关键词：

CONVERTED LEDS; RADIANT-FLUX; PERFORMANCE; IMPACT; EFFICIENCY;

D O I：

10.1002/adom.201300207

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

For further improvements to the reliability and the white light quality of phosphor-converted light-emitting diodes (LEDs), it is imperative to understand how the compositional, optical, and thermal properties of the materials constituting the color-conversion elements (CCEs) affect their respective thermal loads. By means of a combined optical and thermal simulation procedure, a comprehensive discussion is given on the underlying coherences of the absorption profile of the blue LED light, the phosphor concentration, the quantum efficiency of the phosphor, and the thermal conductivities of the CCEs. Some general strategies of material composition and design are deduced in order to minimize the thermal load of the CCEs, which is a prerequisite for correlated color temperature maintenance and long-term material reliability of phosphor-converted white LEDs.

引用

页码：753 / 762

页数：10

共 48 条

[1] Thermal management of LEDs: Package to system [J].

Arik, M ;

Becker, C ;

Weaver, S ;

Petroski, J .

THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 :64-75

[2]

ARIK M, 2003, P ASME IEEE INT EL P

[3]

Bohan Yan, 2013, 2013 IEEE 15th International Symposium and Exhibition on Advanced Packaging Materials (APM 2013), P274, DOI 10.1109/ISAPM.2013.6510411

[4] 'Flip glass substrate' package technology for LED yield and performance enhancement [J].

Chang-Chien, Chien-Lin ;

Huang, Yu-Che ;

Yip, Ming-Chuen ;

Fang, Weileun .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 22 (10)

[5] High-Efficiency White LED Packaging with Reduced Phosphor Concentration [J].

Chen, Ching-Yi ;

Yang, Tsung-Hsun ;

Hsu, Chien-Hung ;

Sun, Ching-Cherng .

IEEE PHOTONICS TECHNOLOGY LETTERS, 2013, 25 (07) :694-696

[6] LEDs for Solid-State Lighting: Performance Challenges and Recent Advances [J].

Crawford, Mary H. .

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 2009, 15 (04) :1028-1040

[7]

Enigl R., 2000, THESIS VIENNA U TECH

[8] Gmsh: A 3-D finite element mesh generator with built-in pre- and post-processing facilities [J].

Geuzaine, Christophe ;

Remacle, Jean-Francois .

INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, 2009, 79 (11) :1309-1331

[9]

Gubbels F., 2013, SILICONES ELECT IND

[10] Phosphor-converted LED modeling using near-field chromatic luminance data [J].

Hsiao, Shu-Li ;

Hu, Neng-Chung ;

Cornelissen, Hugo .

OPTICS EXPRESS, 2013, 21 (05) :A250-A261

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