Impact of barrier thickness on Analog, RF and Linearity performance of nanoscale DG heterostructure MOSFET

被引:21
作者
Biswas, Kalyan [1 ]
Sarkar, Angsuman [2 ]
Sarkar, Chandan Kumar [3 ]
机构
[1] MCKV Inst Engn, ECE Dept, Liluah, WB, India
[2] Kalyani Govt Engn Coll, ECE Dept, Kalyani, WB, India
[3] Jadavpur Univ, ETCE Dept, Nano Device Simulat Lab, Kolkata, WB, India
关键词
Heterostructure MOSFET; Analog/RF performance; Linearity; Barrier thickness; III-V MOSFET; Double gate; GATE; LENGTH; CMOS;
D O I
10.1016/j.spmi.2015.06.047
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
In this work, we have analyzed the Analog, RF and Linearity performance of InP/InGaAs hetero-junction MOSFET using TCAD device simulation. A detailed investigation of the impact of barrier layer thickness on different Analog, RF and Linearity performance of an InGaAs/InP heterostructure DG MOSFET is carried out. A thorough analysis of the key figure-of-merits such as transconductance (g(m)), Output resistance (R-0), gate capacitance, cutoff frequency (f(T)), maximum frequency of oscillation (f(max)), VIP2, VIP3, IIP3, IMD3 and 1 dB compression point are performed for various barrier thickness ranging from 1 nm to 4 nm. From the simulation results it is observed that performance of nanoscale DG heterostructure MOSFET is affected by the variation of barrier thickness of the device. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:95 / 104
页数:10
相关论文
共 27 条
[1]   High electron mobility transistors based on the AlN/GaN heterojunction [J].
Adikimenakis, A. ;
Aretouli, K. E. ;
Iliopoulos, E. ;
Kostopoulos, A. ;
Tsagaraki, K. ;
Konstantinidis, G. ;
Georgakilas, A. .
MICROELECTRONIC ENGINEERING, 2009, 86 (4-6) :1071-1073
[2]   Antimonide-based compound semiconductors for electronic devices: A review [J].
Bennett, BR ;
Magno, R ;
Boos, JB ;
Kruppa, W ;
Ancona, MG .
SOLID-STATE ELECTRONICS, 2005, 49 (12) :1875-1895
[3]  
Colinge J.-P., 2002, PHYS SEMICONDUCTOR D
[4]   Effect of localised charges on nanoscale cylindrical surrounding gate MOSFET: Analog performance and linearity analysis [J].
Gautam, Rajni ;
Saxena, Manoj ;
Gupta, R. S. ;
Gupta, Mridula .
MICROELECTRONICS RELIABILITY, 2012, 52 (06) :989-994
[5]  
Gu G., 2012, J SEMICONDUCTORS, V33
[6]   Linearity analysis of CMOS for RF application [J].
Kang, S ;
Choi, B ;
Kim, B .
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (03) :972-977
[7]   Optimization of RF linearity in DG-MOSFETs [J].
Kaya, S ;
Ma, W .
IEEE ELECTRON DEVICE LETTERS, 2004, 25 (05) :308-310
[8]   Laterally asymmetric channel engineering in fully depleted double gate SOI MOSFETs for high performance analog applications [J].
Kranti, A ;
Chung, TM ;
Flandre, D ;
Raskin, JP .
SOLID-STATE ELECTRONICS, 2004, 48 (06) :947-959
[9]   Device linearity and intermodulation distortion comparison of dual material gate and conventional AlGaN/GaN high electron mobility transistor [J].
Kumar, Sona P. ;
Agrawal, Anju ;
Chaujar, Rishu ;
Gupta, R. S. ;
Gupta, Mridula .
MICROELECTRONICS RELIABILITY, 2011, 51 (03) :587-596
[10]   245-GHz InAlN/GaN HEMTs With Oxygen Plasma Treatment [J].
Lee, Dong Seup ;
Chung, Jinwook W. ;
Wang, Han ;
Gao, Xiang ;
Guo, Shiping ;
Fay, Patrick ;
Palacios, Tomas .
IEEE ELECTRON DEVICE LETTERS, 2011, 32 (06) :755-757