Effects of PCB Substrate Surface Finish and Flux on Solderability of Lead-Free SAC305 Alloy

被引：13

作者：

Siewiorek, A. ^{[1
]}

Kudyba, A. ^{[1
]}

Sobczak, N. ^{[1
]}

Homa, M. ^{[1
]}

Huber, Z. ^{[2
]}

Adamek, Z. ^{[2
]}

Wojewoda-Budka, J. ^{[3
]}

机构：

[1] Foundry Res Inst, Ctr High Temp Studies, PL-30418 Krakow, Poland

[2] Fideltronik IMEL Ltd, PL-34200 Sucha Beskidzka, Poland

[3] Polish Acad Sci, Inst Met & Mat Sci, PL-30059 Krakow, Poland

来源：

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE | 2013年 / 22卷 / 08期

关键词：

flux; lead-free SAC305 alloy; PCB finish; solderability; wetting balance test; SN-AG-CU; FREE SOLDERS; WETTABILITY;

D O I：

10.1007/s11665-013-0492-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The solderability of the SAC305 alloy in contact with printed circuit boards (PCB) having different surface finishes was examined using the wetting balance method. The study was performed at a temperature of 260 A degrees C on three types of PCBs covered with (1) hot air solder leveling (HASL LF), (2) electroless nickel immersion gold (ENIG), and (3) organic surface protectant (OSP), organic finish, all on Cu substrates and two types of fluxes (EF2202 and RF800). The results showed that the PCB substrate surface finish has a strong effect on the value of both the wetting time t (0) and the contact angle theta. The shortest wetting time was noted for the OSP finish (t (0) = 0.6 s with EF2202 flux and t (0) = 0.98 s with RF800 flux), while the ENIG finish showed the longest wetting time (t (0) = 1.36 s with EF2202 flux and t (0) = 1.55 s with RF800 flux). The theta values calculated from the wetting balance tests were as follows: the lowest theta of 45A degrees was formed on HASL LF (EF2202 flux), the highest theta of 63A degrees was noted on the OSP finish, while on the ENIG finish, it was 58A degrees (EF2202 flux). After the solderability tests, the interface characterization of cross-sectional samples was performed by means of scanning electron microscopy coupled with energy dispersive spectroscopy.

引用

页码：2247 / 2252

页数：6

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