Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

被引：7

作者：

Liu, YC ^{[1
]}

Lin, WH ^{[1
]}

Lin, HJ ^{[1
]}

Chuang, TH ^{[1
]}

机构：

[1] Natl Taiwan Univ, Inst Mat Sci & Engn, Taipei 106, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2006年 / 35卷 / 01期

关键词：

Sn-8Zn-20In solder; intermetallic compounds; Au/Ni/Cu pad; Ag/Cu pad; ball shear strength;

D O I：

10.1007/s11664-006-0197-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

During the reflow process of Sn-8Zn-20In solder joints in the ball grid array (BGA) packages with Au/Ni/Cu and Ag/Cu pads, the Au and Ag thin films react with liquid solder to form gamma(3)-AuZn4/gamma-Au7Zn18 and epsilon-AgZn6 intermetallics, respectively. The gamma(3)/gamma intermetallic layer is prone to floating away from the solder/Ni interface, and the appearance of any interfacial intermetallics cannot be observed in the Au/Ni surface finished Sn-8Zn-20In packages during further aging treatments at 75 degrees C and 115 degrees C. In contrast, epsilon-CuZn5/gamma-Cu5Zn8 intermetallics are formed at the aged Sn-8Zn-20In/Cu interface of the immersion Ag BGA packages. Bonding strengths of 3.8N and 4.0N are found in the reflowed Sn-8Zn-20In solder joints with Au/Ni/Cu and Ag/Cu pads, respectively. Aging at 75 degrees C and 115 degrees C gives slight increases of ball shear strength for both cases.

引用

页码：147 / 153

页数：7

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