Reduction of current collapse in the multi-mesa-channel AlGaN/GaN HEMT

被引:9
作者
Ohi, Kota [1 ]
Hashizume, Tamotsu [1 ]
机构
[1] Hokkaido Univ, Grad Sch Informat Sci & Technol, Kita Ku, Sapporo, Hokkaido 0608628, Japan
来源
PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 9, NO 3-4 | 2012年 / 9卷 / 3-4期
关键词
AlGaN/GaN; HEMT; multi-mesa-channel (MMC); current collapse; GAN; PASSIVATION; SUPPRESSION;
D O I
10.1002/pssc.201100301
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
Transport properties and off-stress-induced current collapse characteristics of the multi-mesa-channel (MMC) AlGaN/GaN HEMTs were investigated. The surrounding field effect in the MMC structure led to a shallower threshold voltage and a smaller subthreshold slope compared to those of the conventional planar HEMT. After applying off-state bias stress, the planar HEMT showed remarkable current collapse, including significant increase in on-resistance increasing the drain stress bias. On the other hand, for the MMC HEMT, we observed less change in on-resistance (R-ON) even after the application of high drain bias stress. This shows that the MMC structure has resistance to the off-stress-induced current collapse. In the case of a mesa-top width (W-top) of less than 100 nm, the channel resistance of the MMC HEMT is estimated to be about one order of magnitude higher than the increase in access resistance induced by the off-state stress. It is thus likely that the operation of the MMC HEMT is rather insensitive to change in access resistance. (C) 2012 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
收藏
页码:898 / 902
页数:5
相关论文
共 15 条
[1]   Effect of Gate Leakage in the Subthreshold Characteristics of AlGaN/GaN HEMTs [J].
Chung, Jinwook W. ;
Roberts, John C. ;
Piner, Edwin L. ;
Palacios, Tomas .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (11) :1196-1198
[2]   MOVPE, processing and characterization of AlGaN/GaN HEMTs with different Al concentrations on silicon substrates [J].
Fieger, M. ;
Eickelkamp, M. ;
Koshroo, L. Rahimzadeh ;
Dikme, Y. ;
Noculak, A. ;
Kalisch, H. ;
Heuken, M. ;
Jansen, R. H. ;
Vescan, A. .
JOURNAL OF CRYSTAL GROWTH, 2007, 298 :843-847
[3]   Surface passivation of GaN and GaN/AlGaN heterostructures by dielectric films and its application to insulated-gate heterostructure transistors [J].
Hashizume, T ;
Ootomo, S ;
Inagaki, T ;
Hasegawa, H .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2003, 21 (04) :1828-1838
[4]   Suppression of current collapse in insulated gate AlGaN/GaN heterostructure field-effect transistors using ultrathin Al2O3 dielectric [J].
Hashizume, T ;
Ootomo, S ;
Hasegawa, H .
APPLIED PHYSICS LETTERS, 2003, 83 (14) :2952-2954
[5]   Over 100 A operation normally-off AlGaN/GaN hybrid MOS-HFET on Si substrate with high-breakdown voltage [J].
Kambayashi, Hiroshi ;
Satoh, Yoshihiro ;
Ootomo, Shinya ;
Kokawa, Takuya ;
Nomura, Takehiko ;
Kato, Sadahiro ;
Chow, Tat-sing Pawl .
SOLID-STATE ELECTRONICS, 2010, 54 (06) :660-664
[6]   Enhancement-Mode GaN MIS-HEMTs With n-GaN/i-AlN/n-GaN Triple Cap Layer and High-k Gate Dielectrics [J].
Kanamura, Masahito ;
Ohki, Toshihiro ;
Kikkawa, Toshihide ;
Imanishi, Kenji ;
Imada, Tadahiro ;
Yamada, Atsushi ;
Hara, Naoki .
IEEE ELECTRON DEVICE LETTERS, 2010, 31 (03) :189-191
[7]   Low On-Resistance High-Breakdown Normally Off AlN/GaN/AlGaN DHFET on Si Substrate [J].
Medjdoub, F. ;
Derluyn, J. ;
Cheng, K. ;
Leys, M. ;
Degroote, S. ;
Marcon, D. ;
Visalli, D. ;
Van Hove, M. ;
Germain, M. ;
Borghs, G. .
IEEE ELECTRON DEVICE LETTERS, 2010, 31 (02) :111-113
[8]   Drain Current Stability and Controllability of Threshold Voltage and Subthreshold Current in a Multi-Mesa-Channel AlGaN/GaN High Electron Mobility Transistor [J].
Ohi, Kota ;
Hashizume, Tamotsu .
JAPANESE JOURNAL OF APPLIED PHYSICS, 2009, 48 (08) :0810021-0810025
[9]   High-power recessed-gate AlGaN-GaNHFET with a field-modulating plate [J].
Okamoto, Y ;
Ando, Y ;
Nakayama, T ;
Hataya, K ;
Miyamoto, H ;
Inoue, T ;
Senda, M ;
Hirata, K ;
Kosaki, M ;
Shibata, N ;
Kuzuhara, M .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2004, 51 (12) :2217-2222
[10]   High breakdown voltage AlGaN-GaN Power-HEMT design and high current density switching behavior [J].
Saito, W ;
Takada, Y ;
Kuraguchi, M ;
Tsuda, K ;
Omura, I ;
Ogura, T ;
Ohashi, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (12) :2528-2531