The Effects of N2 Flow Rates on the Properties of Ti-Al-Si-N Films Deposited by Arc Ion Plating

被引:1
|
作者
Feng, Changjie [1 ]
Xin, Li [2 ]
Zhu, Shenglong [2 ]
Shao, Zhisong [1 ]
机构
[1] Nanchang Hangkong Univ, Sch Mat Sci & Engn, Nanchang 330063, Peoples R China
[2] Chinese Acad Sci, Inst Met Res, State Key Lab Corros & Protect, Shenyang 110016, Peoples R China
来源
ADVANCES IN ENERGY SCIENCE AND TECHNOLOGY, PTS 1-4 | 2013年 / 291-294卷
基金
中国国家自然科学基金;
关键词
Ti-Al-Si-N films; N-2 flow rate; microstructure; microhardness; adhesion property;
D O I
10.4028/www.scientific.net/AMM.291-294.2694
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
Ti-Al-Si-N films were deposited on 1Crl 1Ni2W2MoV steel at different N-2 flow rates from 0 to 600 sccm by AIP using a Ti60Al30Si10 target. The effects of the N-2 flow rates on the deposition rate, composition, microstructure, microhardness and adhesion property of the films were investigated by SEM/EDS, XRD, microhardness and scratch tests, respectively. The results show that the deposition rate of the films decreased initially and then began to increase at N-2 flow rate higher than 300 sccm. The microhardness of the films increased with the N-2 flow rate except a slight drop at 450sccm. The evolution of adhesion property of the films was very similar to that of microhardness. All the Ti-Al-Si-N films had B1 NaCl structure with (220) preferred orientation except that at 600 sccm. The effects of the N-2 flow rate on the properties of the Ti-Al-Si-N films were discussed.
引用
收藏
页码:2694 / +
页数:2
相关论文
共 50 条
  • [1] EFFECT OF Si CONTENT ON THE MICROSTRUCTURE AND MECHANICAL PROPERTIES OF Ti-Al-Si-N FILMS DEPOSITED BY CATHODIC VACUUM ARC ION PLATING
    Shi Jing
    Pei Zhiliang
    Gong Jun
    Sun Chao
    Muders, C. M.
    Jiang Xin
    ACTA METALLURGICA SINICA, 2012, 48 (11) : 1349 - 1356
  • [2] Effect of Cu addition on properties of Ti-Al-Si-N nanocomposite films deposited by cathodic vacuum arc ion plating
    Shi, J.
    Kumar, A.
    Zhang, L.
    Jiang, X.
    Pei, Z. L.
    Gong, J.
    Sun, C.
    SURFACE & COATINGS TECHNOLOGY, 2012, 206 (11-12): : 2947 - 2953
  • [3] Effects of Si addition on the microstructural evolution and hardness of TI-Al-Si-N films prepared by the hybrid system of arc ion plating and sputtering techniques
    Park, IW
    Choi, SR
    Lee, MH
    Kim, KH
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (04): : 895 - 899
  • [4] Deposition process and mechanical properties of (Ti, Al, Cr)N films deposited by multi arc ion plating
    Wang, Chuang
    Zhang, Jun
    Weixi Jiagong Jishu/Microfabrication Technology, 2008, (05): : 16 - 18
  • [5] Investigation of phase structure and performance of (Ti, Al)N films deposited by arc ion plating
    Li, MS
    Wang, FH
    Wang, TG
    Gong, J
    Sun, C
    Wen, LS
    ACTA METALLURGICA SINICA, 2003, 39 (01) : 55 - 60
  • [6] Ti-Al-Si-N films for superhard coatings deposited by reactive cosputtering using Ti, Al, and Si targets
    Miyamura, A.
    Yamaguchi, M.
    Hattori, K.
    Sato, Y.
    Nakamura, S.
    Shigesato, Y.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2007, 25 (04): : 1103 - 1107
  • [7] Characterization of (Ti, Al) N films synthesized by Arc Ion Plating
    Choi, Se-Weon
    Kim, Young-Chan
    Chang, Se-Hun
    Oh, Ik-Hyun
    Kang, Chang-Seog
    ADVANCED MATERIALS AND PROCESSING, 2007, 26-28 : 641 - +
  • [8] Oxidation Behavior of Ti-Al-Si-N-O Nanocomposite Films Deposited by Filtered Arc Ion Plating Technique
    Heo, Sungbo
    Lee, Myungsup
    Kim, Hyundong
    Kim, Wang Ryeol
    Kim, Jun-Ho
    Park, In-Wook
    Kim, Daeil
    JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 2019, 19 (07) : 4195 - 4198
  • [9] Nanocomposite Ti-Si-N, Zr-Si-N, Ti-Al-Si-N, Ti-Al-V-Si-N thin film coatings deposited by vacuum arc deposition
    Martin, PJ
    Bendavid, A
    Cairney, JM
    Hoffman, M
    SURFACE & COATINGS TECHNOLOGY, 2005, 200 (07): : 2228 - 2235
  • [10] Effect of nitrogen partial pressure on Al-Ti-N films deposited by arc ion plating
    Cai, Fei
    Zhang, Shihong
    Li, Jinlong
    Chen, Zhong
    Li, Mingxi
    Wang, Lei
    APPLIED SURFACE SCIENCE, 2011, 258 (05) : 1819 - 1825