Reliability and failure analysis of MEMS/NEMS switches

被引：0

作者：

Lee, Chengkuo ^{[1
,2
,3
,4
,5
]}

机构：

[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore, Singapore

[2] Natl Univ Singapore, Grad Sch Integrat Sci & Engn, Singapore, Singapore

[3] Natl Univ Singapore, Ctr Intelligent Sensors & MEMS CISM, Singapore, Singapore

[4] NUS Suzhou Res Inst NUSRI, Suzhou Ind Pk, Suzhou 215123, Peoples R China

[5] Natl Univ Singapore, Singapore Inst Neurotechnol SINAPSE, Singapore, Singapore

来源：

PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2016年

关键词：

MEMS; NEMS; Switch; Relay; Reliability; Failure Analysis; Packaging; DEGREES-C; MEMS; ISSUES;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Microelectromechnical system (MEMS) and nanoelectromechanical system (NEMS) devices have widely deployed in many places now. When they are used in harsh environment, reliability remains as a grand challenge because these devices are exposed to catastrophic level of pressure, temperature, radiation and so on, while there are free-standing structures and movable parts in MEMS and NEMS. In this invited talk, general reliability related concerns of MEMS and NEMS are discussed first. MEMS/NEMS switches are experimentally investigated in terms of reliability and failure analysis.

引用

页码：408 / 413

页数：6

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