Reliability and failure analysis of MEMS/NEMS switches

被引：0
|
作者：
Lee, Chengkuo [1 ,2 ,3 ,4 ,5 ]
机构：
[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore, Singapore
[2] Natl Univ Singapore, Grad Sch Integrat Sci & Engn, Singapore, Singapore
[3] Natl Univ Singapore, Ctr Intelligent Sensors & MEMS CISM, Singapore, Singapore
[4] NUS Suzhou Res Inst NUSRI, Suzhou Ind Pk, Suzhou 215123, Peoples R China
[5] Natl Univ Singapore, Singapore Inst Neurotechnol SINAPSE, Singapore, Singapore
来源：
PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2016年
关键词：
MEMS; NEMS; Switch; Relay; Reliability; Failure Analysis; Packaging; DEGREES-C; MEMS; ISSUES;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Microelectromechnical system (MEMS) and nanoelectromechanical system (NEMS) devices have widely deployed in many places now. When they are used in harsh environment, reliability remains as a grand challenge because these devices are exposed to catastrophic level of pressure, temperature, radiation and so on, while there are free-standing structures and movable parts in MEMS and NEMS. In this invited talk, general reliability related concerns of MEMS and NEMS are discussed first. MEMS/NEMS switches are experimentally investigated in terms of reliability and failure analysis.
引用
收藏
页码：408 / 413
页数：6
相关论文
共 50 条
  • [21] RF MEMS Switches with SiC Microbridges for Improved Reliability
    Scardelletti, Maximilian C.
    Zorman, Christian. A.
    Oldham, Daniel R.
    2008 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, VOLS 1-9, 2008, : 4030 - +
  • [22] Pull-in behavior of functionally graded micro/nano-beams for MEMS and NEMS switches
    Gorgani, Hamid Haghshenas
    Adeli, Mohsen Mahdavi
    Hosseini, Mohammad
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2019, 25 (08): : 3165 - 3173
  • [23] Pull-in behavior of functionally graded micro/nano-beams for MEMS and NEMS switches
    Hamid Haghshenas Gorgani
    Mohsen Mahdavi Adeli
    Mohammad Hosseini
    Microsystem Technologies, 2019, 25 : 3165 - 3173
  • [24] Carbon-Based Materials: Growth, Properties, MEMS/NEMS Technologies, and MEM/NEM Switches
    Liao, Meiyong
    Koide, Yasuo
    CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 2011, 36 (02) : 66 - 101
  • [25] Instrumentation and methodology for MEMS testing, reliability assessment and failure analysis
    De Wolf, I
    2004 24TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, VOLS 1 AND 2, 2004, : 57 - 63
  • [26] System Reliability Analysis of MEMS Gyroscope with Multiple Failure Modes
    Feng, Hengzhen
    Lou, Wenzhong
    Wang, Dakui
    Zheng, Fuquan
    Liao, Maohao
    PROCEEDINGS OF 2018 10TH INTERNATIONAL CONFERENCE ON MODELLING, IDENTIFICATION AND CONTROL (ICMIC), 2018,
  • [27] On the reliability of electrostatic NEMS/MEMS devices: Review of present knowledge on the dielectric charging and stiction failure mechanisms and novel characterization methodologies
    Zaghloul, Usama
    Papaioannou, George
    Bhushan, Bharat
    Coccetti, Fabio
    Pons, Patrick
    Plana, Robert
    MICROELECTRONICS RELIABILITY, 2011, 51 (9-11) : 1810 - 1818
  • [28] Failure mechanisms of DC and capacitive RF MEMS switches
    Patton, Steven T.
    Zabinski, Jeffrey S.
    RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/ MOEMS V, 2006, 6111
  • [29] MEMS and NEMS Research for Education
    Husak, M.
    Jakovenko, J.
    NSTI NANOTECH 2008, VOL 1, TECHNICAL PROCEEDINGS: MATERIALS, FABRICATION, PARTICLES, AND CHARACTERIZATION, 2008, : 1057 - +
  • [30] ESD failure signature in capacitive RF MEMS switches
    Ruan, J.
    Papaioannou, G. J.
    Nolhier, N.
    Mauran, N.
    Bafleur, M.
    Coccetti, F.
    Plana, R.
    MICROELECTRONICS RELIABILITY, 2008, 48 (8-9) : 1237 - 1240
12345