Reliability and failure analysis of MEMS/NEMS switches

被引：0
|
作者：
Lee, Chengkuo [1 ,2 ,3 ,4 ,5 ]
机构：
[1] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore, Singapore
[2] Natl Univ Singapore, Grad Sch Integrat Sci & Engn, Singapore, Singapore
[3] Natl Univ Singapore, Ctr Intelligent Sensors & MEMS CISM, Singapore, Singapore
[4] NUS Suzhou Res Inst NUSRI, Suzhou Ind Pk, Suzhou 215123, Peoples R China
[5] Natl Univ Singapore, Singapore Inst Neurotechnol SINAPSE, Singapore, Singapore
来源：
PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA) | 2016年
关键词：
MEMS; NEMS; Switch; Relay; Reliability; Failure Analysis; Packaging; DEGREES-C; MEMS; ISSUES;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Microelectromechnical system (MEMS) and nanoelectromechanical system (NEMS) devices have widely deployed in many places now. When they are used in harsh environment, reliability remains as a grand challenge because these devices are exposed to catastrophic level of pressure, temperature, radiation and so on, while there are free-standing structures and movable parts in MEMS and NEMS. In this invited talk, general reliability related concerns of MEMS and NEMS are discussed first. MEMS/NEMS switches are experimentally investigated in terms of reliability and failure analysis.
引用
收藏
页码：408 / 413
页数：6
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