共 50 条
- [1] Development, validation, and application of thermal modeling for a MCM power package NINETEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 2003, : 144 - 150
- [3] Improved Package Modeling and Correlation Methodology for High Speed IO Design 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 985 - 991
- [4] The Ehub Modeling Tool: A flexible software package for district energy system optimization CISBAT 2017 INTERNATIONAL CONFERENCE FUTURE BUILDINGS & DISTRICTS - ENERGY EFFICIENCY FROM NANO TO URBAN SCALE, 2017, 122 : 541 - 546
- [6] Analytical Equivalent Circuit Modeling for Multiple Core Vias in a High-Speed Package 2016 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2016, : 233 - 238
- [7] Modeling of package air-conditioning equipment ADVANCES IN BUILDING TECHNOLOGY, VOLS I AND II, PROCEEDINGS, 2002, : 165 - 172
- [8] Thermal characterization of tape BGA package by modeling MICROELECTRONIC YIELD, RELIABILITY, AND ADVANCED PACKAGING, 2000, 4229 : 202 - 208
- [10] Modeling and Simulation of IC and Package Power/Ground Network 2006 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, PROCEEDINGS, 2006, : 696 - 701