Operations of hydrogenated diamond metal-oxide-semiconductor field-effect transistors after annealing at 500 °C

被引:16
作者
Liu, J-W [1 ]
Oosato, H. [2 ]
Da, B. [3 ]
Teraji, T. [1 ]
Kobayashi, A. [4 ]
Fujioka, H. [4 ]
Koide, Y. [5 ]
机构
[1] Natl Inst Mat Sci, Res Ctr Funct Mat, 1-1 Namiki, Tsukuba, Ibaraki 3050044, Japan
[2] NIMS, Nanofabricat Platform, 1-2-1 Sengen, Tsukuba, Ibaraki 3050047, Japan
[3] NIMS, Res & Serv Div Mat Data & Integrated Syst, Tsukuba, Ibaraki 3050047, Japan
[4] Univ Tokyo, Inst Ind Sci, Tokyo 1538508, Japan
[5] NIMS, Res Network & Facil Serv Div, 1-2-1 Sengen, Tsukuba, Ibaraki 3050047, Japan
关键词
diamond; MOSFET; high-temperature; POWER; FREQUENCY;
D O I
10.1088/1361-6463/ab1e31
中图分类号
O59 [应用物理学];
学科分类号
摘要
Operations for hydrogenated diamond (H-diamond) metal-oxide-semiconductor field-effect transistors (MOSFETs) after annealing at 500 degrees C are investigated. SiOx films are employed as oxide insulators for the II-diamond MOSFETs. Before annealing, the current output maximum, on/off ratio, and subthreshold swing for the SiOx/H-diamond MOSFET are -53.3 mA mm(-1), 1.4 x 10(9), and 88 mV dec(-1), respectively. After annealing at 500 degrees C for as long as 60min, although leakage current density of the SiOx/H-diamond MOS capacitor increases, good operations and distinct pinch-off characteristics are observed for the SiOx/H-diamond MOSFET with the above electrical properties of -2.6 mA mm(-1), 1.4 x 10(4), and 530 mV dec(-1), respectively. Stable electrical characteristics are confirmed for the annealed SiOx/H-diamond MOSFET after 35 cycles repeat measurements. This study is meaningful to the development of H-diamond MOSFETs for high-temperature applications.
引用
收藏
页数:7
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