Bottom anti-reflective coatings: Control of thermal processing

被引：7
|
作者：
Schiltz, A
Terpan, JF
Brun, S
Paniez, PJ
机构：
[1] France Telecom, CNET-Grenoble, F-38240 Meylan Cedex
来源：
MICROELECTRONIC ENGINEERING | 1996年 / 30卷 / 1-4期
关键词：
D O I：
10.1016/0167-9317(95)00246-4
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper investigates the thermal process conditions of the Bottom Anti-Reflective Layer for i-Line lithography (BARLi) using various characterization techniques such as TGA and WCM (Tg). The thermal modifications of the material are related to the variations in its functional properties, namely degree of solubility, absorption, thickness and reflectivity. A thermal process window is defined to obtain a maximum improvement from this technology.
引用
收藏
页码：283 / 286
页数：4
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