De-embedding transmission line measurements for accurate modeling of IC designs

被引：265

作者：

Mangan, AM ^{[1
]}

Voinigescu, SP

Yang, MT

Tazlauanu, M

机构：

[1] Univ Toronto, Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada

[2] TSMC, Hsinchu 30077, Taiwan

[3] Quake Technol Inc, Ottawa, ON K2K 2T8, Canada

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 2006年 / 53卷 / 02期

基金：

加拿大创新基金会;

关键词：

characterization; de-embedding; deep-submicrometer; technologies; integrated circuits; interconnect; losses; microstrip lines; slotted ground planes; transmission lines;

D O I：

10.1109/TED.2005.861726

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new technique to de-embed the contributions of parasitic structures from transmission line measurements is presented and applied to microstrip lines fabricated in 90- and 130-nm RF-CMOS technologies. De-embedded measurements are used to extract characteristic impedance, attenuation constant, group delay, and effective permittivity. The effective thickness of the ground plane is demonstrated to be as important as the thickness of the top metal layer in minimizing interconnect loss. Furthermore, it is confirmed that metal area densities as low as 65% are adequate for the ground plane of microstrip lines.

引用

页码：235 / 241

页数：7

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