New efficient method of modeling electronics packages with power and ground planes

被引：0
|
作者：
Shi, WM
Fang, JY
机构：
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2001年
关键词：
D O I：
10.1109/EPEP.2001.967654
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper introduces a new efficient numerical technique for the computation of fields in electronics packages with power and ground planes. This full wave approach can be conveniently integrated with circuit solvers. Skin-effect loss from metal planes and dielectric loss, together with the non-total reflections from outer edges of planes, can be easily incorporated. A special computation scheme was developed for handling vias between metal planes. Very good correlation has been achieved on printed-circuit test boards up to several GHz.
引用
收藏
页码：237 / 240
页数：4
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