Low-Power Resistive Memory Integrated on III-V Vertical Nanowire MOSFETs on Silicon

被引:16
作者
Ram, Mamidala Saketh [1 ]
Persson, Karl-Magnus [1 ]
Borg, Mattias [1 ,2 ]
Wernersson, Lars-Erik [1 ]
机构
[1] Lund Univ, Dept Elect & Informat Technol, S-22100 Lund, Sweden
[2] Lund Univ, NanoLund, S-22100 Lund, Sweden
关键词
Logic gates; Switches; Ions; Random access memory; Electrodes; MOSFET; Metals; Resistive random access memory (RRAM); ITO; vertical nanowire; InAs; InGaAs; gate-all-around MOSFET; TRANSISTORS;
D O I
10.1109/LED.2020.3013674
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
III-V vertical nanowire MOSFETs (VNW-FETs) have the potential to extend Moore's law owing to their excellent material properties. To integrate highly scaled memory cells coupled with high performance selectors at minimal memory cell area, it is attractive to integrate low-power resistive random access memory (RRAM) cells directly on to III-V VNW-FETs. In this work, we report the experimental demonstration of successful RRAM integration with III-V VNW-FETs. The combined use of VNW-FET drain metal electrode and the RRAM bottom electrode reduces the process complexity and maintains material compatibility. The vertical nanowire geometry allows the RRAM cell area to be aggressively scaled down to 0.01 mu(m2) enabling realization of dense memory (1T1R) cross-point arrays on silicon.
引用
收藏
页码:1432 / 1435
页数:4
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