Analysis and simulation of self-heating effects on RE LDMOS devices

被引:0
作者
Belaïd, MA [1 ]
Ketata, K [1 ]
Maanane, H [1 ]
Gares, M [1 ]
Mourgues, K [1 ]
Marcon, J [1 ]
机构
[1] Univ Rouen, IUT Rouen, LEMI, F-76821 Mont St Aignan, France
来源
SISPAD: 2005 International Conference on Simulation of Semiconductor Processes and Devices | 2005年
关键词
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper presents a study of the temperature and self heating effects on RF LDMOS devices. A new electro-thermal model is implemented in Agilent's ADS, using a Symbolic Defined Device (SDD). The proposed model takes into account the thermal effects and the influence of temperature on the I-V and C-V characteristics, by providing three thermal resistances and three thermal capacitances, which represent the heat flow from the chip to the ambient air (thermal network). The new model is thoroughly assessed against extensive 2-D simulations performed using a numerical device model. The results indicate a good agreement with all operating conditions.
引用
收藏
页码:231 / 234
页数:4
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