Effects of multi-layer graphene capping on Cu interconnects

被引：61

作者：

Kang, Chang Goo ^{[1
]}

Lim, Sung Kwan ^{[2
]}

Lee, Sangchul ^{[2
]}

Lee, Sang Kyung ^{[1
]}

Cho, Chunhum ^{[2
]}

Lee, Young Gon ^{[1
]}

Hwang, Hyeon Jun ^{[1
]}

Kim, Younghun ^{[1
]}

Choi, Ho Jun ^{[1
]}

Choe, Sun Hee ^{[1
]}

Ham, Moon-Ho ^{[1
,2
]}

Lee, Byoung Hun ^{[1
,2
]}

机构：

[1] Gwangju Inst Sci & Technol, Sch Mat Sci & Engn, Kwangju 500712, South Korea

[2] Gwangju Inst Sci & Technol, Dept Nanobio Mat & Elect, Kwangju 500712, South Korea

来源：

NANOTECHNOLOGY | 2013年 / 24卷 / 11期

关键词：

CARBON NANOTUBE; THERMAL-CONDUCTIVITY;

D O I：

10.1088/0957-4484/24/11/115707

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The benefits of multi-layer graphene (MLG) capping on Cu interconnects have been experimentally demonstrated. The resistance of MLG capped Cu wires improved by 2-7% compared to Cu wires. The breakdown current density increased by 18%, suggesting that the MLG can act as an excellent capping material for Cu interconnects, improving the reliability characteristics. With a proper process optimization, MLG capped Cu interconnects could become a promising technology for high density back end-of-line interconnects.

引用

页数：5

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