New model for low-temperature oxidation of copper single crystal

被引：53

作者：

Fujita, Kensuke ^{[1
]}

Ando, Daisuke ^{[2
]}

Uchikoshi, Masahito ^{[1
]}

Mimura, Kouji ^{[1
]}

Isshiki, Minoru ^{[1
]}

机构：

[1] Tohoku Univ, Inst Multidisciplinary Res Adv Mat, Sendai, Miyagi 9808577, Japan

[2] Tohoku Univ, Dept Mat Sci, Sendai, Miyagi 9808579, Japan

来源：

APPLIED SURFACE SCIENCE | 2013年 / 276卷

关键词：

Low-temperature oxidation; Copper; Ellipsometry; Grain growth; LOGARITHMIC RATE LAW; THIN-FILMS; NICKEL-OXIDE; KINETICS; GROWTH; ELLIPSOMETRY; DIFFUSION; THICKNESS; METALS; SPECTROSCOPY;

D O I：

10.1016/j.apsusc.2013.03.096

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Low-temperature oxidation of a copper single crystal, Cu(1 1 1), was investigated using an in situ spectroscopic ellipsometer. The oxidation rate followed the cubic rate law at 5-25 nm oxide thickness; thus, the rate law of Cu single crystal oxidation depended on Cu oxide thickness. Furthermore, the activation energy was found to be close to that of grain boundary diffusion of metal ions in the oxide layer. These results could be explained by grain boundary diffusion and oxide grain growth. Thus, we verified that the low-temperature oxidation kinetics of copper depend on oxide grain growth. (C) 2013 Elsevier B.V. All rights reserved.

引用

页码：347 / 358

页数：12

共 72 条

[51] INVESTIGATION OF THE OXIDATION BEHAVIOR OF THIN-FILM AND BULK COPPER [J].

OREILLY, M ;

JIANG, X ;

BEECHINOR, JT ;

LYNCH, S ;

NIDHEASUNA, CN ;

PATTERSON, JC ;

CREAN, GM .

APPLIED SURFACE SCIENCE, 1995, 91 (1-4) :152-156

[52] Optical and structural properties of copper oxide thin films grown by oxidation of metal layers [J].

Papadimitropoulos, G. ;

Vourdas, N. ;

Vamvakas, V. Em. ;

Davazoglou, D. .

THIN SOLID FILMS, 2006, 515 (04) :2428-2432

[53] Mechanistic investigation of ZnO nanowire growth [J].

Rackauskas, Simas ;

Nasibulin, Albert G. ;

Jiang, Hua ;

Tian, Ying ;

Statkute, Gintare ;

Shandakov, Sergey D. ;

Lipsanen, Harri ;

Kauppinen, Esko I. .

APPLIED PHYSICS LETTERS, 2009, 95 (18)

[54] THE OXIDATION-KINETICS OF THIN COPPER-FILMS STUDIED BY ELLIPSOMETRY [J].

RAUH, M ;

WISSMANN, P .

THIN SOLID FILMS, 1993, 228 (1-2) :121-124

[55] ELLIPSOMETRIC STUDIES ON THE OXIDATION OF THIN COPPER-FILMS [J].

RAUH, M ;

WISSMANN, P ;

WOLFEL, M .

THIN SOLID FILMS, 1993, 233 (1-2) :289-292

[56] LOW TEMPERATURE OXIDATION OF COPPER .1. PHYSICAL MECHANISM [J].

RHODIN, TN .

JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 1950, 72 (11) :5102-5106

[57] A CRITICAL-APPRAISAL OF THE LOGARITHMIC RATE LAW IN THIN-FILM FORMATION DURING OXIDATION OF COPPER AND ITS ALLOYS [J].

ROY, SK ;

SIRCAR, SC .

OXIDATION OF METALS, 1981, 15 (1-2) :9-20

[58] Field-induced cation migration in Cu oxide films by in situ scanning tunneling microscopy [J].

Singh, JP ;

Lu, TM ;

Wang, GC .

APPLIED PHYSICS LETTERS, 2003, 82 (26) :4672-4674

[59] A COPPER POLYIMIDE METAL-BASE PACKAGING TECHNOLOGY [J].

TAKASAGO, H ;

ADACHI, K ;

TAKADA, M .

JOURNAL OF ELECTRONIC MATERIALS, 1989, 18 (02) :319-326

[60] INITIAL OXIDATION RATE OF NICKEL AND EFFECT OF THE CURIE TEMPERATURE [J].

UHLIG, H ;

PICKETT, J ;

MACNAIRN, J .

ACTA METALLURGICA, 1959, 7 (02) :111-117

← 1 2 3 4 5 6 7 8 →