Mechanical and thermal properties of polymer composites for electronic packaging application

Alumina (AE) and mica (ME) particles were used as fillers in epoxy-based polymer composites. Comparisons were made between the composites with respect to mechanical, thermal, and morphological properties. Mechanical and thermal studies were performed on the composites at various filler contents. Dispersion of the filler was evaluated using scanning electron micrograph (SEM). It was found that the flexural modulus of the composites was almost identical as far as AE and ME are concerned, particularly at 025 vol% of filler content. However, obvious increment was observed in the case of AE for flexural strength.