Effect of Reflow Process on Glass Transition Temperature of Printed Circuit Board Laminates

被引：0
作者：
Lall, Pradeep [1 ]
Narayan, Vikalp [1 ]
Suhling, Jeff [1 ]
Blanche, Jim [2 ]
Strickland, Mark [2 ]
机构：
[1] Auburn Univ, Dept Mech Engn, Elect Res Ctr NSF CAVE3, Auburn, AL 36849 USA
[2] NASA, Marshall Space Flight Ctr, Huntsville, AL USA
来源：
2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM) | 2012年
关键词：
glass transition temperature; leadfree; time above liquidus; peak temperature; number of reflows;
D O I：
暂无
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
The effect of temperature exposure encountered both during assembly and in fielded products, has a known influence on glass transition temperature of printed-circuit board (PCB) laminate materials. Printed circuit board laminates such as FR4 are composites of epoxy resin with woven fiberglass reinforcement. Interaction between manufacturing process variables that impact the changes in glass transition temperature (T-g) has been studied. The laminates studied have been broadly classified into high-T-g, and mid-T-g laminates. Different sets of reflow profiles were created by varying the process variables including, time above liquidus, peak temperature, ramp rate and cooling rate. The effect of multiple reflows encountered in normal assembly or board rework has been studied by exposing the assemblies to multiple reflows between 2x-6x. Changes to the glass transition temperature have been classified by measurement of the glass transition temperature were measured via Thermo Mechanical Analysis (TMA). Statistical analysis of the variables has been used to determine the statistical significance of the measured changes for large populations.
引用
收藏
页码：261 / 268
页数：8
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