A resonant micro accelerometer based on electrostatic stiffness variation

被引：36

作者：

Comi, Claudia ^{[1
]}

Corigliano, Alberto ^{[1
]}

Ghisi, Aldo ^{[1
]}

Zerbini, Sarah ^{[2
]}

机构：

[1] Politecn Milan, Dept Civil & Environm Engn, I-20133 Milan, Italy

[2] STMicroelectronics, AMS Grp, I-20010 Cornaredo, Italy

来源：

MECCANICA | 2013年 / 48卷 / 08期

关键词：

MEMS; Resonant accelerometer; Electrostatic stiffness; Out-of plane sensing; Pull-in instability;

D O I：

10.1007/s11012-013-9768-x

中图分类号：

O3 [力学];

学科分类号：

08 ; 0801 ;

摘要：

A new out-of-plane resonant micro-machined accelerometer has been designed, modelled and fabricated. The sensing principle is based on the variation of the electrostatic stiffness of two torsional resonators mechanically coupled with an inertial proof mass. The accelerometer, fabricated by the ThELMA (R) surface micro-machining process of STMicroelectronics, constitutes a further step of a research focussing on the design of in-plane and out-of-plane resonant micro accelerometers. Preliminary electrostatic measures of the torsional resonators response have been compared with the theoretical predictions.

引用

页码：1893 / 1900

页数：8

共 15 条

[1] Resonant accelerometer with self-test [J].

Aikele, M ;

Bauer, K ;

Ficker, W ;

Neubauer, F ;

Prechtel, U ;

Schalk, J ;

Seidel, H .

SENSORS AND ACTUATORS A-PHYSICAL, 2001, 92 (1-3) :161-167

[2]

[Anonymous], 2002, MICROSYSTEM DESIGN

[3] Evaluation of MEMS capacitive accelerometers [J].

Béliveau, A ;

Spencer, GT ;

Thomas, KA ;

Roberson, SL .

IEEE DESIGN & TEST OF COMPUTERS, 1999, 16 (04) :48-56

[4]

Burns D. W., 1995, 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Digest of Technical Papers (IEEE Cat. No.95TH8173), P659

[5]

Comi C, 2011, PROC IEEE MICR ELECT, P529, DOI 10.1109/MEMSYS.2011.5734478

[6] A Resonant Microaccelerometer With High Sensitivity Operating in an Oscillating Circuit [J].

Comi, Claudia ;

Corigliano, Alberto ;

Langfelder, Giacomo ;

Longoni, Antonio ;

Tocchio, Alessandro ;

Simoni, Barbara .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2010, 19 (05) :1140-1152

[7] Mechanical characterization of polysilicon through on-chip tensile tests [J].

Corigliano, A ;

De Masi, B ;

Frangi, A ;

Comi, C ;

Villa, A ;

Marchi, M .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (02) :200-219

[8] Pull-in study of an electrostatic torsion microactuator [J].

Degani, O ;

Socher, E ;

Lipson, A ;

Leitner, T ;

Setter, DJ ;

Kaldor, S ;

Nemirovsky, Y .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1998, 7 (04) :373-379

[9]

Gardner J.W., 2001, MICROSENSORS MEMS SM

[10]

Kim HC, 2005, Transducers '05, Digest of Technical Papers, Vols 1 and 2, P172

← 1 2 →