ELECTRICAL INTERCONNECT AND MICROFLUIDIC COOLING WITHIN 3D ICs AND SILICON INTERPOSER

被引：0
|
作者：
Oh, Hanju [1 ]
Zhang, Yue [1 ]
Zheng, Li [1 ]
Bakir, Muhannad S. [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
PROCEEDINGS OF THE ASME 12TH INTERNATIONAL CONFERENCE ON NANOCHANNELS, MICROCHANNELS, AND MINICHANNELS, 2014 | 2014年
关键词：
DESIGN; PERFORMANCE;
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
Heat dissipation is a significant challenge for three-dimensional integrated circuits (3D IC) due to the lack of heat removal paths and increased power density. In this paper, a 3D IC system with an embedded microfluidic cooling heat sink (MFHS) is presented. In the proposed 3D IC system, high power tiers contain embedded MFHS and high-aspect ratio (23:1) through-silicon-vias (TSVs) routed through the integrated MFHS. In addition, each tier has dedicated solder-based microfluidic chip I/Os. Microfluidic cooling experiments of staggered micropin-fms with embedded TSVs are presented for the first time. Moreover, the lateral thermal gradient across a chip is analyzed with segmented heaters.
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页数：7
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