High-Performance RF Devices and Components on Flexible Cellulose Substrate by Vertically Integrated Additive Manufacturing Technologies

被引:32
|
作者
Mariotti, Chiara [1 ]
Alimenti, Federico [2 ]
Roselli, Luca [2 ]
Tentzeris, Manos M. [3 ]
机构
[1] Infineon Technol Austria AG, A-9500 Villach, Austria
[2] Univ Perugia, Dept Engn, I-06123 Perugia, Italy
[3] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
关键词
Additive manufacturing (AM); copper adhesive laminate; flexible electronics; green electronics; inkjet printing; Internet of Everything (IoE); Internet of Things (IoT); passive components; INTERNET; THINGS;
D O I
10.1109/TMTT.2016.2615934
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper aims to demonstrate that novel additive manufacturing (AM) technologies like metal adhesive laminate and multilayer inkjet printing can be effectively exploited to fabricate high-performing radio-frequency passive components on flexible substrates. Both processes are substrate independent and therefore suitable for manufacturing circuits on several unconventional materials, such as photo-paper. In addition, their complementary features can be combined to develop a novel hybrid process. Proof-of-concept AM prototypes of passive components, such as capacitors and inductors, exhibiting quality factors over 70, never achieved before on paper, and selfresonant frequencies beyond 4 GHz are described. The maximum inductance and capacitance per unit area are 1.4 nH/mm(2) and 6.5 pF/mm(2), respectively. Moreover, an AM RF mixer with a conversion loss below 10 dB is demonstrated still on paper substrate. The mixer, fabricated with the copper adhesive laminate method, operates at 1 GHz and exploits a lumped balun transformer connected to two packaged diodes in series.
引用
收藏
页码:62 / 71
页数:10
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