Contributions of atomic diffusion and plastic deformation to the diffusion bonding of metallic glass to crystalline aluminum alloy

被引:8
作者
Chen, H. Y. [1 ]
Cao, J. [1 ]
Liu, J. K. [1 ]
Song, X. G. [2 ]
Feng, J. C. [1 ,2 ]
机构
[1] Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin 150001, Peoples R China
[2] Harbin Inst Technol, Sch Mat Sci & Engn, Weihai 264209, Peoples R China
基金
中国国家自然科学基金;
关键词
Bulk metallic glass; Aluminum alloy; Diffusion bonding; Oxide film; SURFACE-TREATMENT; TEMPERATURE; BEHAVIOR; MODEL; TOUGHNESS; COMPOSITE; PLASMA;
D O I
10.1016/j.commatsci.2013.01.027
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A mathematical model was established to estimate the contributions of different mechanisms to the diffusion bonding of Zr-based bulk metallic glass to crystalline aluminum alloy. Additionally, the fraction of contact area with oxide film phi was introduced into the model since oxide film is the main barrier to atomic bonding across interface at lower temperature. The model calculation displayed that the plastic deformation of Al alloy dominated the void formation stage, while the homogeneous plastic flow of BMG played a major role in the void shrinkage stage. The joints bonded by two different methods were used to verify the model. The experimental strength of joints achieved by pre-friction assisted diffusion bonding and Ar ion assisted diffusion bonding had a sound fit with the theoretical strength curves of phi = 28% and 22.5%, respectively. (c) 2013 Elsevier B.V. All rights reserved.
引用
收藏
页码:179 / 183
页数:5
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