Optimizing the heat source layout of chips using bionic method: Reduction of junction temperature

被引：14
作者：
Dang, Hao [1 ]
Zhang, Qian [2 ]
Lu, Yang [1 ]
Zhang, Xiu [2 ]
Ma, Weigang [1 ]
Zhang, Xing [1 ]
机构：
[1] Tsinghua Univ, Dept Engn Mech, Key Lab Thermal Sci & Power Engn, Minist Educ, Beijing 100084, Peoples R China
[2] Zhongxing Telecom Equipment Corp, Shanghai 201203, Peoples R China
来源：
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER | 2022年 / 197卷
关键词：
FCBGA package; Thermal spreading resistance; Junction temperature; Heat source layout; Bionic optimization; OPTIMIZATION; PLACEMENT; FLOW;
D O I：
10.1016/j.ijheatmasstransfer.2022.123321
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Optimizing the heat source layout to reduce the junction temperature is an important topic in the ther-mal design field of chips. However, the relationship between the heat source layout and the junction temperature is still ambiguous, and the optimization method suitable for actual chips is still rare, while it is quite desirable in engineering. In this work, we propose a feasible strategy to optimize the heat source layout using bionic method, and demonstrate the strategy by a flip chip ball grid array (FCBGA) case. The optimized layout can reduce the junction temperature and thermal spreading resistance by 2.38 K and 30.94%, respectively. The mechanism can be attributed to the heat dissipation advantage at the corner and edge positions of the heat source surface and the low temperature coupling between heat sources in the optimization process. This work illustrates a great promising potential of the bionic optimization method in the design of the CPU and GPU chips.(c) 2022 Elsevier Ltd. All rights reserved.
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页数：7
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