Electrical and thermal properties of Cu-Ta films prepared by magnetron sputtering

被引:7
作者
Qin, Wen [1 ]
Fu, Licai [1 ]
Zhu, Jiajun [1 ]
Yang, Wulin [1 ]
Sang, Jianquan [1 ]
Li, Deyi [1 ]
Zhou, Lingping [1 ]
机构
[1] Hunan Univ, Coll Mat Sci & Engn, Changsha 410082, Hunan, Peoples R China
基金
中国国家自然科学基金;
关键词
Cu-Ta film; Electrical resistivity; Thermal conductivity; Magnetron sputtering; X-RAY-DIFFRACTION; ALLOYS; TEMPERATURE; DIFFUSIVITY; RESISTIVITY; HARDNESS;
D O I
10.1016/j.apsusc.2018.02.262
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The microstructure, electrical resistivity and thermal conductivity of the sputtering deposited Cu-Ta films were investigated as a function of Ta content. The results showed that the amorphous phase formed between 20 at.% and 60 at.% Ta, and out of this range alpha-Cu(Ta) and beta-Ta(Cu) solid solutions formed. Because the lattice distortion and beta-Ta structure could significantly increase the probability of electron scattering, the electrical resistivity of the Cu-Ta films shows a 'N' type change with the increase of Ta content, and the inflection point appears at 50 at.% Ta and 60 at.% Ta respectively. As the thermal conductance is also dominated by electrons in metals films, an opposite variation tendency is found in the thermal conductivity of the Cu-Ta films. According to our knowledge, this is the first time to measure the thermal conductivity of Cu-Ta thin films. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码:97 / 102
页数:6
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