Thermal Resistance Investigation of Ceramic Substrates for High-Power Light-Emitting Diodes Packaging

被引：0

作者：

Chen, Zhen ^{[1
]}

Cheng, Hao ^{[1
]}

Peng, Yang ^{[1
]}

Chen, Mingxiang ^{[1
]}

Li, Ruixin ^{[2
]}

机构：

[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China

[2] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan, Peoples R China

来源：

2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年

关键词：

high-power light-emitting diodes (LEDs); metallized ceramic substrate; thermal resistance; thermal transient testing;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thermal resistance model of packaged light emitting diode (LED) samples was proposed to investigate the thermal performances of different ceramic substrates. The thermal resistances of four metallized ceramic substrates were measured by using thermal transient tester. Consequently, the thermal resistances of TFC-Al2O3, DPC-Al2O3, DBC-Al2O3 and DPC-AlN are 8.09 K/W, 7.05 K/W, 4.78 K/W, and 1.57 K/W, respectively. Experimental results also demonstrate that fabrication process and ceramic materials can greatly affect the thermal performances of ceramic substrate.

引用

页码：745 / 748

页数：4

共 12 条

[1]

Alan M., 2003, 3 VS REV, V16, P30

[2]

Arik M., 2001, ASME IEEE INTERPACK, P113

[3]

Graham S, 2007, SPIE C SERIES, V6669

[4]

Groman S, 2011, EUR MICROELECTRON PA

[5] A method for projecting useful life of LED lighting systems [J].

Hong, E ;

Narendran, N .

THIRD INTERNATIONAL CONFERENCE ON SOLID STATE LIGHTING, 2004, 5187 :93-99

[6] Visible Flip-Chip Light-Emitting Diodes on Flexible Ceramic Substrate With Improved Thermal Management [J].

Kim, Seung Hwan ;

Singh, Shivkant ;

Oh, Seung Kyu ;

Lee, Dong Kyu ;

Lee, Keon Hwa ;

Shervin, Shahab ;

Asadirad, Mojtaba ;

Venkateswaran, Venkat ;

Olenick, Kathy ;

Olenick, John A. ;

Lee, Sung-Nam ;

Kwak, Joon Seop ;

Mavrokefalos, Anastassios ;

Ryou, Jae-Hyun .

IEEE ELECTRON DEVICE LETTERS, 2016, 37 (05) :615-617

[7] Fundamental analysis for visible-light communication system using LED lights [J].

Komine, T ;

Nakagawa, M .

IEEE TRANSACTIONS ON CONSUMER ELECTRONICS, 2004, 50 (01) :100-107

[8] Improvement of thermal management of high-power GaN-based light-emitting diodes [J].

Liou, Bo-Hung ;

Chen, Chih-Ming ;

Horng, Ray-Hua ;

Chiang, Yi-Chen ;

Wuu, Dong-Sing .

MICROELECTRONICS RELIABILITY, 2012, 52 (05) :861-865

[9]

Ru H., 2011, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2011), P311, DOI 10.1109/IMPACT.2011.6117219

[10]

Shanmugan S, 2014, J ELECTRON PACKAGING, V136, P1780

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