Thermal Resistance Investigation of Ceramic Substrates for High-Power Light-Emitting Diodes Packaging

被引：0
|
作者：
Chen, Zhen [1 ]
Cheng, Hao [1 ]
Peng, Yang [1 ]
Chen, Mingxiang [1 ]
Li, Ruixin [2 ]
机构：
[1] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China
[2] Wuhan Univ Technol, Sch Mat Sci & Engn, Wuhan, Peoples R China
来源：
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2016年
关键词：
high-power light-emitting diodes (LEDs); metallized ceramic substrate; thermal resistance; thermal transient testing;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Thermal resistance model of packaged light emitting diode (LED) samples was proposed to investigate the thermal performances of different ceramic substrates. The thermal resistances of four metallized ceramic substrates were measured by using thermal transient tester. Consequently, the thermal resistances of TFC-Al2O3, DPC-Al2O3, DBC-Al2O3 and DPC-AlN are 8.09 K/W, 7.05 K/W, 4.78 K/W, and 1.57 K/W, respectively. Experimental results also demonstrate that fabrication process and ceramic materials can greatly affect the thermal performances of ceramic substrate.
引用
收藏
页码：745 / 748
页数：4
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