Signal Integrity Analysis for High Speed On-Chip Interconnects Using Differential Evolution Algorithm

被引：0

作者：

Sabanayagam, A. ^{[1
]}

Kumar, V. Abhai ^{[1
]}

Raju, S. ^{[1
]}

Kumar, N. Suresh ^{[1
]}

机构：

[1] THIAGARAJAR COLL ENGN, DEPT ECE, Madurai 625015, Tamil Nadu, India

来源：

INCEMIC 2008: 10TH INTERNATIONAL CONFERENCE ON ELECTROMAGNETIC INTERFERENCE AND COMPATIBILITY, PROCEEDINGS | 2008年

关键词：

Cross talk; inter; -connects; signal integrity; coupled microstrip line; mutual inductance; mutual capacitance; Differential Evolution Algorithm; Genetic Algorithm (GA);

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new search heuristic termed Differential Evolution (DE) has shown superior performance in several real - world applications. It has received increased interest from the evolutionary computation (EC) community. In this paper the performance of DE on finding. the optimal solution for the determination of cross talk, propagation delay and physical dimensions of high speed interconnects are taken. The structure used for analysis was coupled microstrip line model. The results are compared with already obtained GA Results.

引用

页码：117 / 122

页数：6

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