Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications

被引：41

作者：

Made, Riko I. ^{[1
,2
,3
]}

Gan, Chee Lip ^{[1
,2
]}

Yan, Li Ling ^{[3
]}

Yu, Aibin ^{[3
]}

Yoon, Seung Wook ^{[3
]}

Lau, John H. ^{[3
]}

Lee, Chengkuo ^{[3
,4
]}

机构：

[1] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore

[2] Singapore MIT Alliance, Adv Mat Micro & Nanosyst, Singapore 117576, Singapore

[3] Agcy Sci Technol & Res, Inst Microelect, Singapore 117685, Singapore

[4] Natl Univ Singapore, Dept Elect & Comp Engn, Singapore 117576, Singapore

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2009年 / 38卷 / 02期

关键词：

Low-temperature solder; indium; IC; MEMS; packaging; INTERMETALLIC PHASE-FORMATION;

D O I：

10.1007/s11664-008-0555-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400A degrees C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180A degrees C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag9In4 in the bonded joints.

引用

页码：365 / 371

页数：7

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