Circuit-Level Layout-Aware Single-Event Sensitive-Area Analysis of 40-nm Bulk CMOS Flip-Flops Using Compact Modeling

被引:23
作者
Kauppila, Jeffrey S. [1 ]
Haeffner, Timothy D. [1 ]
Ball, Dennis R. [1 ]
Kauppila, Amy V. [2 ]
Loveless, T. Daniel [1 ]
Jagannathan, Srikanth [2 ]
Sternberg, Andrew L. [1 ]
Bhuva, Bharat L. [2 ]
Massengill, Lloyd W. [2 ]
机构
[1] Vanderbilt Univ, ISDE, Nashville, TN 37212 USA
[2] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37212 USA
关键词
Charge sharing; circuit modeling; circuit simulation; CMOS integrated circuits; compact models; flip-flops; latches; radiation effects; single-event upset (SEU); SPICE; FLIP/FLOP DESIGNS; UPSETS;
D O I
10.1109/TNS.2011.2172692
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A circuit-level layout-aware single-event simulation capability is presented. Multiple 40-nm bulk CMOS flip-flops are analyzed to determine single-event upset (SEU) sensitive area. Comparisons between simulation results and broadbeam heavy-ion test data show excellent agreement. Simulations of single-event strikes over the entire flip-flop layout can be performed in less than 1 h.
引用
收藏
页码:2680 / 2686
页数:7
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