An investigation on the aggregate-shape embedded piezoelectric sensor for civil infrastructure health monitoring

被引：59

作者：

Song, Shanglin ^{[1
]}

Hou, Yue ^{[1
]}

Guo, Meng ^{[1
]}

Wang, Linbing ^{[2
]}

Tong, Xinlong ^{[1
]}

Wu, Jiangfeng ^{[1
]}

机构：

[1] Univ Sci & Technol Beijing, Natl Ctr Mat Serv Safety, Beijing 100083, Peoples R China

[2] Virginia Tech, USTB, Joint USTB Virginia Tech Lab Multifunct Mat, Blacksburg, VA 24061 USA

来源：

CONSTRUCTION AND BUILDING MATERIALS | 2017年 / 131卷

基金：

国家高技术研究发展计划(863计划);

关键词：

Piezoelectric sensor; Aggregate-shape; Embedded; Infrastructure; Health monitoring; ASPHALT BINDER; STRAIN; RESISTANCE; STRENGTH; FAILURE;

D O I：

10.1016/j.conbuildmat.2016.11.050

中图分类号：

TU [建筑科学];

学科分类号：

0813 ;

摘要：

In this paper, a new type of aggregate-shape embedded piezoelectric sensor for health monitoring of civil infrastructures was developed. The sensor was designed by using piezoelectric ceramic chip as the functional phase, and a new composite material as packaging phase. 3D printing technology was also used for packaging system design and sensor fabrication. The frequency independence, linearity, sensitivity, response rate, and service performance of the sensor were tested by frequency scanning and amplitude scanning. Experimental results show that within the vibration frequency range of common civil engineering structures, the new aggregate-shape embedded piezoelectric sensor has good mechanical and workability properties. Test results also show that the new embedded sensors have very good mechanical electrical coupling performance, which builds a solid foundation for further application in the civil engineering infrastructures. (C) 2016 Elsevier Ltd. All rights reserved.

引用

页码：57 / 65

页数：9

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