Heat-cycle endurance and in-plane thermal expansion of Al2O3/Al substrates formed by aerosol deposition method

被引：12

作者：

Sakamaki, Ryo ^{[1
]}

Hoshina, Takuya ^{[1
]}

Kakemoto, Hirofumi ^{[1
]}

Yasuda, Kouichi ^{[1
]}

Takeda, Hiroaki ^{[1
]}

Akedo, Jun ^{[2
]}

Tsurumi, Takaaki ^{[1
]}

机构：

[1] Tokyo Inst Technol, Grad Sch Sci & Engn, Meguro Ku, Tokyo 1528552, Japan

[2] Natl Inst Adv Ind Sci & Technol, Tsukuba, Ibaraki 3058564, Japan

来源：

JOURNAL OF THE CERAMIC SOCIETY OF JAPAN | 2008年 / 116卷 / 1360期

关键词：

Aerosol deposition method; Al2O3; Thermal expansion coefficient; Heat radiation; High power module;

D O I：

10.2109/jcersj2.116.1299

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A new heat radiation substrate for high power modules has been proposed by utilizing Al2O3 thick films formed by the aerosol deposition method (ADM) on Al substrates. Dense Al2O3 thick films (AD-Al2O3) could be obtained by the ADM at room temperature. A heat-cycle endurance test between -80 degrees C and 180 degrees C revealed that the AD-Al2O3/Al substrates were superior to the conventional direct brazed aluminum (DBA) substrates using AlN ceramics bounded to Al substrates. No lamination was observed between the AD-Al2O3 films and Al substrates after heat-cycle test in spite of the difference of thermal expansion coefficient between Al2O3 and Al. The in-plane thermal expansion coefficient of AD-Al2O3 films was almost the same as that of Al substrates, indicating that plastic deformation was induced in the AD-Al2O3 films consisting of nano-sized grains to relax the stress caused by the difference of thermal expansion coefficient. (c) 2008 The Ceramic society of Japan. All rights reserved.

引用

页码：1299 / 1303

页数：5

共 21 条

[1] Microstructure and electrical properties of lead zirconate titanate (Pb(Zr52/Ti48)O3) thick films deposited by aerosol deposition method [J].