5-methyl-1H-benzotriazole as potential corrosion inhibitor for electrochemical-mechanical planarization of copper

被引：16
|
作者：
Bian, Yan-fei [1 ]
Zhai, Wen-jie [1 ]
Zhu, Bao-quan [1 ]
机构：
[1] Harbin Inst Technol, Sch Mechatron Engn, Harbin 150001, Peoples R China
来源：
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2013年 / 23卷 / 08期
基金：
中国国家自然科学基金;
关键词：
electrochemical-mechanical planarization; 5-methyl-1H-benzotriazole; corrosion inhibitor; chloride ion; PHOSPHORIC-ACID; CU; FILMS; BENZOTRIAZOLE; ELECTROLYTE; SLURRIES; CHLORIDE; MEDIA; ECMP; CMP;
D O I：
10.1016/S1003-6326(13)62751-X
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
According to the electrochemical analysis, the corrosion inhibition efficiency of 5-methyl-1H-benzotriazole (m-BTA) is higher than that of benzotrizaole (BTA). The inhibition capability of the m-BTA passive film formed in hydroxyethylidenediphosphonic acid (HEDP) electrolyte containing both m-BTA and chloride ions is superior to that formed in m-BTA-alone electrolyte, even at a high anodic potential. The results of electrical impedance spectroscopy, nano-scratch experiments and energy dispersive analysis of X-ray (EDAX) indicate that the enhancement of m-BTA inhibition capability may be due to the increasing thickness of passive film. Furthermore, X-ray photoelectron spectrometry (XPS) analysis indicates that the increase in passive film thickness can be attributed to the incorporation of Cl- into the m-BTA passive film and the formation of [Cu(I)Cl(m-BTA)](n) polymer film on Cu surface. Therefore, the introduction of Cl-into m-BTA-containing HEDP electrolyte is effective to enhance the passivation capability of m-BTA passive film, thus extending the operating potential window.
引用
收藏
页码：2431 / 2438
页数：8
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