Microstructure influencing physical and mechanical properties of electrolytic tough pitch copper produced by equal channel angular pressing

被引：12

作者：

Higuera, Oscar F. ^{[1
,2
]}

Cabrera, Jose M. ^{[1
,3
]}

机构：

[1] Univ Politecn Cataluna, Dept Ciencia Mat & Ingn Met, E-08028 Barcelona, Spain

[2] Univ Tecnol Pereira, Fac Ingn Mecan, Vereda La Julita, Pereira, Colombia

[3] Fundacio CTM Ctr Tecnol, Manresa 08242, Spain

来源：

MECHANICS OF MATERIALS | 2013年 / 67卷

关键词：

ECAP; ETP copper; SPD; EBSD; Electrical conductivity; Mechanical properties; THERMAL-STABILITY; PURE COPPER; CU; EXTRUSION; EVOLUTION; ENERGY;

D O I：

10.1016/j.mechmat.2013.07.011

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Samples of electrolytic tough pitch (ETP) copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties were analyzed. Results show that the stored energy increases on increasing ECAP deformation, while the recrystallization temperature decreases significantly. From a mechanical point of view a stable state is attained after 4 passes. Similarly, electrical conductivity slightly decreases down to a saturation state. (C) 2013 Elsevier Ltd. All rights reserved.

引用

页码：9 / 14

页数：6

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