3D-IC Technology and Reliability Challenges

被引：0
|
作者：
Tanaka, Tetsu [1 ]
机构：
[1] Tohoku Univ, Grad Sch Biomed Engn, Aoba Ku, 6-6-12 Aza Aoba, Sendai, Miyagi 9808579, Japan
来源：
2017 17TH INTERNATIONAL WORKSHOP ON JUNCTION TECHNOLOGY (IWJT) | 2017年
关键词：
SILICON;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：51 / 53
页数：3
相关论文
共 50 条
  • [1] 3D-IC Design Challenges and Requirements
    Park, John
    Adams, Sarah
    Advancing Microelectronics, 2022, 49 (02): : 16 - 19
  • [2] Micro Bridge Technology for 3D-IC Interconnection Could Benefit the 3D-IC Test Strategy
    Cheng, H. C.
    Yang, C. Y.
    Cheng, Alan
    Cheng, Karl
    2012 7TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2012,
  • [3] A 3D-IC technology with integrated microchannel cooling
    Sekar, Deepak
    King, Calvin
    Dang, Bing
    Spencer, Todd
    Thacker, Hiren
    Joseph, Paul
    Bakir, Muhannad
    Meindl, James
    PROCEEDINGS OF THE IEEE 2008 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2008, : 13 - +
  • [4] Reliability challenges in 3D IC packaging technology
    Tu, K. N.
    MICROELECTRONICS RELIABILITY, 2011, 51 (03) : 517 - 523
  • [5] 3D-IC technology for contribution to the IoT society
    Kikuchi K.
    Journal of Japan Institute of Electronics Packaging, 2019, 22 (06): : 501 - 506
  • [6] Process technology - interconnect and 3D-IC technologies
    Hasegawa, Toshiaki
    Kohl, Paul
    Technical Digest - International Electron Devices Meeting, IEDM, 2008,
  • [7] DESIGN AND RELIABILITY ASSESSMENT OF NOVEL 3D-IC PACKAGING
    Su, Y. -F.
    Chiang, K. -N.
    Liang, Steven Y.
    JOURNAL OF MECHANICS, 2017, 33 (02) : 193 - 203
  • [8] R&D of 3D-IC Technology for System Integration
    Kikuchi K.
    Journal of Japan Institute of Electronics Packaging, 2023, 26 (04) : 326 - 332
  • [9] The Prospect of 3D-IC
    Wong, S. Simon
    El Gamal, Abbas
    PROCEEDINGS OF THE IEEE 2009 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2009, : 445 - 448
  • [10] Panel: "Will 3D-IC Remain a Technology of the Future ... Even in the Future?"
    Casale-Rossi, Marco
    Leduc, Patrick
    De Micheli, Giovanni
    Blouet, Patrick
    Farley, Brendan
    Fontanelli, Anna
    Milojevic, Dragomir
    Smith, Steve
    DESIGN, AUTOMATION & TEST IN EUROPE, 2013, : 1526 - 1530
12345